The 672 plating process has a low coating resistivity and is therefore very suitable for the electronics industry with high physical property requirements. It is also suitable for various types of substrate metals, copper parts, zinc alloy parts, plastic parts, etc. The coating is not easy to produce pinholes, has low internal stress, and has extremely high ductility. The current density range is wide, and the coating leveling degree can reach up to 75%. The plating effect is bright. The precipitation speed is very fast. At a current density of 4.5A/dm2, a copper layer of 1μm can be plated every minute, thus shortening the plating time. The plating solution is easy to control, and the coating leveling degree is excellent. The impurity tolerance is high. Generally, it only needs to be treated with activated carbon powder after long-term use.
